RO3003 2-Layer 1.4mm PCB – 50mil Ceramic-Filled PTFE with ENIG for RF & Automotive Radar
1.Introduction to RO3003 2-Layer 1.4mm PCB
Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. These laminates provide exceptional stability of dielectric constant (Dk) across various temperatures and frequencies. A key advantage is the elimination of the step change in Dk that typically occurs near room temperature with conventional PTFE glass materials. This characteristic makes RO3003 ideal for demanding applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).
2.Key Features
Rogers RO3003 ceramic-filled PTFE composite material
Dielectric constant: 3.0 ± 0.04 at 10 GHz/23°C
Dissipation factor: 0.001 at 10 GHz/23°C
Thermal decomposition temperature: >500°C
Thermal conductivity: 0.5 W/m·K
Moisture absorption: 0.04%
Coefficient of Thermal Expansion (-55 to 288°C): X-axis 17 ppm/°C, Y-axis 16 ppm/°C, Z-axis 25 ppm/°C
3.Benefits
Low dielectric loss suitable for applications up to 77 GHz
Excellent mechanical properties across temperature variations
Reliable stripline and multi-layer board constructions
Uniform mechanical properties across dielectric constant range
Stable dielectric constant versus temperature and frequency
Low in-plane expansion coefficient matched to copper
Volume manufacturing process for economical pricing
Compatible with epoxy glass multi-layer board hybrid designs
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3003 |
| Layer Count | 2 layers |
| Board Dimensions | 33mm × 63mm |
| Min. Trace/Space | 5 mil / 7 mil |
| Min. Hole Size | 0.3 mm |
| Blind Vias | No |
| Finished Board Thickness | 1.4 mm |
| Finished Cu Weight | 1 oz (outer layers) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RO3003 Substrate - 50mil (1.27mm)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 11
Total Pads: 32
Thru Hole Pads: 20
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 10
Nets: 2
7.Typical Applications
Automotive radar systems (77 GHz)
Global positioning satellite antennas
Cellular telecommunications systems (power amplifiers and antennas)
Patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
